ANALYSIS OF MATERIAL LAYERS ON SURFACES, AND RELATED SYSTEMS AND METHODS

A method of analyzing film on a substrate comprises receiving surface profile data obtained from measurements of a plurality of discrete regions on a substrate, the plurality of discrete regions comprising one or more film layers; extracting a plurality of parameters from the received surface profil...

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Bibliographic Details
Main Authors PARKER, Ian David, CHUN, Doris Pik-Yiu
Format Patent
LanguageEnglish
Published 17.03.2022
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRICITY
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
PHYSICS
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Summary:A method of analyzing film on a substrate comprises receiving surface profile data obtained from measurements of a plurality of discrete regions on a substrate, the plurality of discrete regions comprising one or more film layers; extracting a plurality of parameters from the received surface profile data, the plurality of parameters comprising one or more parameters of the one or more film layers of each of the plurality of discrete regions, wherein the extracting is based on a predetermined pattern for the plurality of the discrete regions on the substrate; and displaying a user interface. The user interface may comprise a plurality of individual graphs each illustrating the one or more parameters of the one or more film layers for a corresponding subset of the plurality of discrete regions, and a composite graph illustrating the one or more parameters of the one or more film layers for each discrete region of the plurality of discrete regions, wherein the composite graph corresponds to the plurality of individual graphs being overlaid together.
Bibliography:Application Number: US202117443798