EMBEDDED THREE-DIMENSIONAL ELECTRODE CAPACITOR

Embedded three-dimensional electrode capacitors, and methods of fabricating three-dimensional electrode capacitors, are described. In an example, an integrated circuit structure includes a first metallization layer above a substrate, the first metallization layer having a first conductive structure...

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Main Authors LI, Zhi, HECK, John, QIAN, Wei, FRISH, Harel, ISENBERGER, Mark, HUANG, Mengyuan, DEFREES, Reece, TRAN, Cung, PARK, Sungbong, MAGRUDER, Kelly, SLAVIN, Seth
Format Patent
LanguageEnglish
Published 17.03.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Embedded three-dimensional electrode capacitors, and methods of fabricating three-dimensional electrode capacitors, are described. In an example, an integrated circuit structure includes a first metallization layer above a substrate, the first metallization layer having a first conductive structure in a first dielectric layer, the first conductive structure having a honeycomb pattern. An insulator structure is on the first conductive structure of the first metallization layer. A second metallization layer is above the first metallization layer, the second metallization layer having a second conductive structure in a second dielectric layer, the second conductive structure on the insulator structure, and the second conductive structure having the honeycomb pattern.
Bibliography:Application Number: US202017024507