BONDING DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME

A bonding device includes: a support in which a plurality of through-holes is defined, a diaphragm disposed on the support to cover the support, a pressing pad disposed on the diaphragm over a top surface of the support, and a window fixing chuck disposed on the pressing pad and in which a groove fa...

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Bibliographic Details
Main Authors KIM, YOUNGSU, YOO, JAESUK, KO, KYUNGROK, YOO, KISANG, CHOI, JEONG-SEOP
Format Patent
LanguageEnglish
Published 10.03.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A bonding device includes: a support in which a plurality of through-holes is defined, a diaphragm disposed on the support to cover the support, a pressing pad disposed on the diaphragm over a top surface of the support, and a window fixing chuck disposed on the pressing pad and in which a groove facing the pressing pad is defined. Here, the pressing pad includes a pad and at least one support bar disposed in the pad and extending in a first direction.
Bibliography:Application Number: US202117355612