STACKED SEMICONDUCTOR PACKAGE WITH STEPPED STIFFENER

According to various examples, a device is described. The device may include a stiffener member including a first step section and a second step section. The device may also include a plurality of vias extending from or through the stiffener member. The device may be coupled to a printed circuit boa...

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Bibliographic Details
Main Authors CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Format Patent
LanguageEnglish
Published 03.03.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:According to various examples, a device is described. The device may include a stiffener member including a first step section and a second step section. The device may also include a plurality of vias extending from or through the stiffener member. The device may be coupled to a printed circuit board.
Bibliography:Application Number: US202017088606