STACKED SEMICONDUCTOR PACKAGE WITH STEPPED STIFFENER
According to various examples, a device is described. The device may include a stiffener member including a first step section and a second step section. The device may also include a plurality of vias extending from or through the stiffener member. The device may be coupled to a printed circuit boa...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
03.03.2022
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Subjects | |
Online Access | Get full text |
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Summary: | According to various examples, a device is described. The device may include a stiffener member including a first step section and a second step section. The device may also include a plurality of vias extending from or through the stiffener member. The device may be coupled to a printed circuit board. |
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Bibliography: | Application Number: US202017088606 |