SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

A device including a package substrate and a heat spreader may be provided. The package substrate may include a first surface and an opposing second surface. The package substrate may include a recess extending from the first surface, and a cavity extending from the second surface to the recess. The...

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Bibliographic Details
Main Authors CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Format Patent
LanguageEnglish
Published 03.03.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A device including a package substrate and a heat spreader may be provided. The package substrate may include a first surface and an opposing second surface. The package substrate may include a recess extending from the first surface, and a cavity extending from the second surface to the recess. The heat spreader may include a first portion and a second portion arranged on the first portion. The first portion may be arranged within the cavity, and the second portion may be at least partially arranged on the second surface of the package substrate
Bibliography:Application Number: US202017090921