SEMICONDUCTOR DEVICE PACKAGE HAVING STRESS ISOLATION AND METHOD THEREFOR

A semiconductor device package having stress isolation is provided. The semiconductor device package includes a package substrate and a sensor attached to the package substrate. A first isolation material is formed around a perimeter of the sensor. An encapsulant encapsulates at least a portion of t...

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Bibliographic Details
Main Authors Vincent, Michael B, Hayes, Scott M, Hooper, Stephen Ryan
Format Patent
LanguageEnglish
Published 03.03.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device package having stress isolation is provided. The semiconductor device package includes a package substrate and a sensor attached to the package substrate. A first isolation material is formed around a perimeter of the sensor. An encapsulant encapsulates at least a portion of the first isolation material and the package substrate.
Bibliography:Application Number: US202017005003