PACKAGE AND PACKAGING METHOD

A packaging construction including the combination of: a first backing; and a second backing with a first major surface including an adhesive layer, wherein the adhesive layer is overlain by a passivation layer, the passivation layer including a patterned seal area that is substantially free of the...

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Bibliographic Details
Main Authors HA, PHONG VANTHANH, VOSSEN, VAL, SIERACKI, JAMES M, PETERSON, DONALD G
Format Patent
LanguageEnglish
Published 10.02.2022
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Summary:A packaging construction including the combination of: a first backing; and a second backing with a first major surface including an adhesive layer, wherein the adhesive layer is overlain by a passivation layer, the passivation layer including a patterned seal area that is substantially free of the passivation layer such that the adhesive layer is exposed in the patterned seal area.
Bibliography:Application Number: US202017427124