METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES USING A HEAT TRANSFER FLUID COMPRISING FLUORINATED COMPOUNDS HAVING A LOW GWP

The present invention relates to a method for manufacturing semiconductor devices, including a step wherein a semi-conductor device exchanges heat with a heat transfer fluid. The heat transfer fluid comprises one or more chemical compounds having the general formula: Ph(ORf)x (I) wherein Ph is an ar...

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Bibliographic Details
Main Authors ANTENUCCI, Emanuela, BRAGANTE, Letanzio, MILLEFANTI, Stefano, KAPELYUSHKO, Valeriy
Format Patent
LanguageEnglish
Published 27.01.2022
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
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Summary:The present invention relates to a method for manufacturing semiconductor devices, including a step wherein a semi-conductor device exchanges heat with a heat transfer fluid. The heat transfer fluid comprises one or more chemical compounds having the general formula: Ph(ORf)x (I) wherein Ph is an aromatic ring linked to one or more ether groups -ORf where each -Rf: - is a monovalent fluorinated alkyl group comprising at least one C-F bond, - has a carbon chain, preferably a C1-C10 carbon chain, which can be linear or can comprise branches and/or cycles, and, optionally, can comprise in chain heteroatoms selected from O, N or S, and wherein, when X>1, the -Rf groups on the same molecule can be equal to or different from each other.
Bibliography:Application Number: US201917312032