INTERPOSER

The present disclosure relates to an interposer. The interposer includes: a support body formed of a ceramic material, a connection electrode configured to the top surface and bottom surface of the support body, and a shielding member disposed at an outer surface of the support body. At least a part...

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Bibliographic Details
Main Authors SHIN, Jungkyun, OH, Changwoo, LEE, Gilseon, AN, Youngjun
Format Patent
LanguageEnglish
Published 06.01.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present disclosure relates to an interposer. The interposer includes: a support body formed of a ceramic material, a connection electrode configured to the top surface and bottom surface of the support body, and a shielding member disposed at an outer surface of the support body. At least a part of the support body is disposed along the edge of a substrate, and electrically connects the substrate and a substrate. The interposer is formed of a ceramic material and thus make it possible to implement a fine pattern, to improve dimensional stability by preventing the bending deformation of ceramic green sheets, and to raise the reliability of signal transmission. Therefore, the interposer can contribute to implementing high performance of an electronic device and reducing the size of the electronic device.
Bibliography:Application Number: US201917291888