Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording Medium

• Main Authors: YAMAGUCHI, Hideto, SHINOZAKI, Kenji, MURATA, Hitoshi, YANAGISAWA, Yoshihiko, YAMAMOTO, Tetsuo, UENO, Masaaki, SAIDO, Shuhei, HARA, Naoki, KIMURA, Kazuhiro, HIROCHI, Yukitomo
• Format: Patent
• Language: English
• Published: 30.12.2021
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS,IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KINDOF FURNACE; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FURNACES; FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; HEATING; KILNS; LIGHTING; MECHANICAL ENGINEERING; OPEN SINTERING OR LIKE APPARATUS; OVENS; RETORTS; SEMICONDUCTOR DEVICES; WEAPONS

According to one aspect of the technique, there is provided a method of manufacturing a semiconductor device, including: (a) heating a heat insulating plate in a substrate retainer to a processing temperature by an electromagnetic wave, and measuring a temperature change of the heat insulating plate by a non-contact type thermometer until the processing temperature; (b) heating a test object provided with a chip that does not transmit a detection light of the thermometer and accommodated in the substrate retainer to the processing temperature, and measuring a temperature change of the chip by the thermometer until the processing temperature; (c) acquiring a correlation between the temperature change of the heat insulating plate and that of the chip based on measurement results; and (d) controlling a heater to heat the substrate based on the correlation and the temperature of the heat insulating plate measured by the thermometer.