TOPSIDE-COOLED SEMICONDUCTOR PACKAGE WITH MOLDED STANDOFF
A molded semiconductor package arrangement may comprise a die pad configured to support a semiconductor; a set of leads; and a mold structure that is formed to enclose the semiconductor and the die pad within the mold structure. The set of leads and the die pad may be formed from a same piece of con...
Saved in:
Main Authors | , , , , |
---|---|
Format | Patent |
Language | English |
Published |
23.12.2021
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A molded semiconductor package arrangement may comprise a die pad configured to support a semiconductor; a set of leads; and a mold structure that is formed to enclose the semiconductor and the die pad within the mold structure. The set of leads and the die pad may be formed from a same piece of conductive material. An electrical contact plane of the set of leads may be offset from a bottom surface of the die pad. The mold structure may include a molded standoff that is beneath the die pad. A bottom surface of the molded standoff may extend below the electrical contact plane of the set of leads by a threshold distance that corresponds to a thickness of the molded standoff. |
---|---|
Bibliography: | Application Number: US202016906617 |