CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
The disclosure provides a circuit substrate and a method for manufacturing the same. The circuit substrate includes a wiring and a substrate having a base region and a circuit region. The base region having a first pattern is constituted by a first thermoplastic material. The circuit region having a...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
16.12.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The disclosure provides a circuit substrate and a method for manufacturing the same. The circuit substrate includes a wiring and a substrate having a base region and a circuit region. The base region having a first pattern is constituted by a first thermoplastic material. The circuit region having a second pattern is constituted by a second thermoplastic material. The first pattern has a portion opposite to the second pattern. The wiring is formed on the circuit region along the second pattern. The first thermoplastic material is different from the second thermoplastic material, and the second thermoplastic material includes a catalyst particle. |
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Bibliography: | Application Number: US202017008636 |