ELECTRONIC DEVICE AND WIRING STRUCTURE THEREOF

• Main Authors: CHANG, Sean, HUANG, Joe, CHENG, Lavender, HUANG, Roger
• Format: Patent
• Language: English
• Published: 09.12.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A wiring structure is provided, including a conductive wiring and an insulating layer. The conductive wiring is disposed on a substrate and has a top side, a bottom side and two side walls opposite to each other. The insulating layer which wraps around the conductive wiring at least through the top...