ELECTRONIC DEVICE AND WIRING STRUCTURE THEREOF
A wiring structure is provided, including a conductive wiring and an insulating layer. The conductive wiring is disposed on a substrate and has a top side, a bottom side and two side walls opposite to each other. The insulating layer which wraps around the conductive wiring at least through the top...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
09.12.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A wiring structure is provided, including a conductive wiring and an insulating layer. The conductive wiring is disposed on a substrate and has a top side, a bottom side and two side walls opposite to each other. The insulating layer which wraps around the conductive wiring at least through the top side and two side walls, wherein there is a gap between the insulating layer and at least one of the two side walls. |
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Bibliography: | Application Number: US202016896100 |