VERTICAL DIE-TO-DIE INTERCONNECTS BRIDGE

The present disclosure relates to a semiconductor package that may include a substrate. The substrate may have a top surface and a bottom surface. The semiconductor package may include an opening in the substrate. The semiconductor package may include a bridge disposed in the opening. The bridge may...

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Bibliographic Details
Main Authors POH, Yang Liang, CHEAH, Bok Eng, OOI, Kooi Chi
Format Patent
LanguageEnglish
Published 09.12.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present disclosure relates to a semiconductor package that may include a substrate. The substrate may have a top surface and a bottom surface. The semiconductor package may include an opening in the substrate. The semiconductor package may include a bridge disposed in the opening. The bridge may have an upper end at the top surface of the substrate and a lower end at the bottom surface of the substrate. The semiconductor package may include a first die on the top surface of the substrate at least partially extending over a first portion of the upper end of the bridge. The semiconductor package may include a second die on the bottom surface of the substrate at least partially extending over the lower end of the bridge. The bridge may couple the first die to the second die.
Bibliography:Application Number: US202016987405