PACKAGE STRUCTURE HAVING TAPER-SHAPED CONDUCTIVE PILLAR AND METHOD OF FORMING THEREOF

A conductive structure, includes: a plurality of conductive layers; a plurality of conductive pillars being formed on the plurality of conductive layers, respectively; and a molding compound laterally coating the plurality of conductive pillars. Each of the plurality of conductive pillars is a taper...

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Bibliographic Details
Main Authors Tsai, Hui-Jung, Kuo, Hung-Jui, Wang, Chia-Wei, Chang, Tai-Min
Format Patent
LanguageEnglish
Published 02.12.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A conductive structure, includes: a plurality of conductive layers; a plurality of conductive pillars being formed on the plurality of conductive layers, respectively; and a molding compound laterally coating the plurality of conductive pillars. Each of the plurality of conductive pillars is a taper-shaped conductive pillar, and is tapered from the conductive layers.
Bibliography:Application Number: US202016886755