FILM FORMING METHOD FOR ORGANIC SEMICONDUCTOR FILM

An object of the present invention is to provide a film forming method for an organic semiconductor film, with which an organic semiconductor film having good uniformity and high mobility can be manufactured with good productivity. A coating liquid is prepared by dissolving an organic semiconductor...

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Bibliographic Details
Main Author IWASE, Eijiro
Format Patent
LanguageEnglish
Published 18.11.2021
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Summary:An object of the present invention is to provide a film forming method for an organic semiconductor film, with which an organic semiconductor film having good uniformity and high mobility can be manufactured with good productivity. A coating liquid is prepared by dissolving an organic semiconductor material in a solvent, the coating liquid is sprayed by a spray unit, and the coating liquid is applied onto a temperature-controlled substrate while the coating liquid during the flight which has been sprayed by the spray unit is being heated, whereby problems are solved.
Bibliography:Application Number: US202117387111