HIGH-VOLTAGE DEVICES INTEGRATED ON SEMICONDUCTOR-ON-INSULATOR SUBSTRATE
The present disclosure generally to semiconductor devices, and more particularly to semiconductor devices having high-voltage transistors integrated on a semiconductor-on-insulator substrate and methods of forming the same. The present disclosure provides a semiconductor device including a semicondu...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
18.11.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure generally to semiconductor devices, and more particularly to semiconductor devices having high-voltage transistors integrated on a semiconductor-on-insulator substrate and methods of forming the same. The present disclosure provides a semiconductor device including a semiconductor-on-insulator (SOI) substrate having a semiconductor layer, a bulk substrate and an insulating layer between the semiconductor layer and the bulk substrate, a source region and a drain region disposed on the bulk substrate, an isolation structure extending through the insulating layer and the semiconductor layer and terminates in the bulk substrate, and a gate structure between the source region and the drain region, the gate structure is disposed on the semiconductor layer. |
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Bibliography: | Application Number: US202016876098 |