ELECTRONIC POWER MODULE

An electronic power module includes at least a semiconductor chip having at least one electronic power component and two metal layers between which the semiconductor chip is directly secured. At least a first of the two metal layers forms a redistribution layer having several distinct metal portions...

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Bibliographic Details
Main Authors WIDIEZ, Julie, CREBIER, Jean-Christophe, VLADIMIROVA, Kremena
Format Patent
LanguageEnglish
Published 11.11.2021
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Summary:An electronic power module includes at least a semiconductor chip having at least one electronic power component and two metal layers between which the semiconductor chip is directly secured. At least a first of the two metal layers forms a redistribution layer having several distinct metal portions, each electrically connected to at least one electrical contact pad of the semiconductor chip, and/or at least one second of the two metal layers includes at least one first structured face arranged against the semiconductor chip and having at least one pad formed in a part of its thickness.
Bibliography:Application Number: US201917272843