SUBSTRATE COMPRISING A SILVER-PLATED SURFACE PROTECTED AGAINST SILVER TARNISHING AND METHOD FOR MANUFACTURING SUCH A SUBSTRATE
A substrate includes a final silver-plated surface protected against silver tarnishing by a protective coat having a thickness between 1 nm and 200 nm, the protective coat includes a first coat of Al2O3 deposited on said final silver-plated surface and having a thickness between 0.5 nm and 100 nm, a...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
11.11.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A substrate includes a final silver-plated surface protected against silver tarnishing by a protective coat having a thickness between 1 nm and 200 nm, the protective coat includes a first coat of Al2O3 deposited on said final silver-plated surface and having a thickness between 0.5 nm and 100 nm, and on the first coat of Al2O3, a second coat of TiO2 having a thickness between 0.5 nm and 100 nm, the substrate including a coat of a silver and copper alloy comprising between 0.1% and 10% by weight of copper with respect to the total weight of the alloy, forming said final silver-plated surface, said coat of a silver and copper alloy having a thickness between 1000 nm and 3000 nm. Embodiments also relate to a method for manufacturing such a substrate. |
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Bibliography: | Application Number: US201917278139 |