FLOW DISTRIBUTOR FOR COOLING AN ELECTRICAL COMPONENT, A SEMICONDUCTOR MODULE COMPRISING SUCH A FLOW DISTRIBUTOR, AND METHOD OF MANUFACTURING THE SAME

• Main Author: Wecker, Georg
• Format: Patent
• Language: English
• Published: 04.11.2021
• Subjects: ADDITIVE MANUFACTURING TECHNOLOGY; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING; BASIC ELECTRIC ELEMENTS; BLASTING; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT EXCHANGE IN GENERAL; HEATING; LIGHTING; MECHANICAL ENGINEERING; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TRANSPORTING; WEAPONS

A flow distributor (1) is provided for distributing a heat transporting fluid flow (2) of an electrical component across a surface to be cooled and/or heated by the fluid. The distributor includes at least one flow channel configured to direct the fluid flow across the surface, the flow channels bei...