FLOW DISTRIBUTOR FOR COOLING AN ELECTRICAL COMPONENT, A SEMICONDUCTOR MODULE COMPRISING SUCH A FLOW DISTRIBUTOR, AND METHOD OF MANUFACTURING THE SAME

• Main Author: Wecker, Georg
• Format: Patent
• Language: English
• Published: 04.11.2021
• Subjects: ADDITIVE MANUFACTURING TECHNOLOGY; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING; BASIC ELECTRIC ELEMENTS; BLASTING; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT EXCHANGE IN GENERAL; HEATING; LIGHTING; MECHANICAL ENGINEERING; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TRANSPORTING; WEAPONS

A flow distributor (1) is provided for distributing a heat transporting fluid flow (2) of an electrical component across a surface to be cooled and/or heated by the fluid. The distributor includes at least one flow channel configured to direct the fluid flow across the surface, the flow channels being delimited on either side by walls (4) so as to form a path (6) for the fluid flow (2) within the flow channels (3), and comprising wall sections (5) extending into the at least one flow channel (3); and at least one of the wall sections (5) includes at least one bypass passage (7) to connect two adjacent spaces (8) separated by the wall section (5) where the at least one bypass passage (7) extends from one side of the wall section to the other one with an inclined orientation (10) so as to create a short circuit flow (9) for apart of the fluid flow (2). Furthermore, a method of manufacturing such a flow distributor is provided, having an insert with the wall structure of the inventive flow distributor which is manufactured by injection molding or by 3D-printing.