POWER SEMICONDUCTOR MODULE WITH PRESS-FIT CONTACT ELEMENT

A power semiconductor module has a substrate, load and auxiliary connector elements, and a plastic body, which preferably is a housing or a housing frame and which has a channel. The channel being for the arrangement of a compensating portion of a press-fit contact element. The press-fit contact ele...

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Bibliographic Details
Main Authors WEHNER, Alexander, BOGEN, INGO
Format Patent
LanguageEnglish
Published 28.10.2021
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Summary:A power semiconductor module has a substrate, load and auxiliary connector elements, and a plastic body, which preferably is a housing or a housing frame and which has a channel. The channel being for the arrangement of a compensating portion of a press-fit contact element. The press-fit contact element has a press-fit portion, a compensating portion and a foot portion, the compensating portion being elastic in a longitudinal direction of the press-fit contact element and having at least two O-shaped sub-portions arranged in succession in the longitudinal direction and having a constriction arranged between two sub-portions.
Bibliography:Application Number: US202117230649