POWER SEMICONDUCTOR MODULE WITH PRESS-FIT CONTACT ELEMENT
A power semiconductor module has a substrate, load and auxiliary connector elements, and a plastic body, which preferably is a housing or a housing frame and which has a channel. The channel being for the arrangement of a compensating portion of a press-fit contact element. The press-fit contact ele...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
28.10.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A power semiconductor module has a substrate, load and auxiliary connector elements, and a plastic body, which preferably is a housing or a housing frame and which has a channel. The channel being for the arrangement of a compensating portion of a press-fit contact element. The press-fit contact element has a press-fit portion, a compensating portion and a foot portion, the compensating portion being elastic in a longitudinal direction of the press-fit contact element and having at least two O-shaped sub-portions arranged in succession in the longitudinal direction and having a constriction arranged between two sub-portions. |
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Bibliography: | Application Number: US202117230649 |