SEMICONDUCTOR POWER DEVICE WITH PRESS-FIT MOUNTING

A semiconductor device, includes a housing; at least one semiconductor die which forms at least one semiconductor component, the semiconductor die being disposed within the housing; one or more first pins extending from the housing; and one or more bond wires electrically connecting the one or more...

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Bibliographic Details
Main Authors Moore, Kevin D, Hernandez Orozco, Irving Uriel
Format Patent
LanguageEnglish
Published 28.10.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device, includes a housing; at least one semiconductor die which forms at least one semiconductor component, the semiconductor die being disposed within the housing; one or more first pins extending from the housing; and one or more bond wires electrically connecting the one or more first pins with the at least one semiconductor component. A heat slug is thermally coupled to the semiconductor die and at least partly disposed within the housing. One or more second pins extends from the housing and is connected to the heat slug. An electronics device includes a printed circuit board and the semiconductor device connected thereto.
Bibliography:Application Number: US202016858204