HOUSINGS FOR ELECTRONIC DEVICES

A housing for an electronic device is described. The housing comprises a molded reinforced plastic, wherein the molded reinforced plastic comprises a woven glass fiber cloth and a single epoxy resin, which is a bisphenol A epoxy resin.

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Bibliographic Details
Main Authors Lin, Kun-Hung, Chang, Shih-hua, Chuang, Po-Feng
Format Patent
LanguageEnglish
Published 21.10.2021
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRICITY
PERFORMING OPERATIONS
PHYSICS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:A housing for an electronic device is described. The housing comprises a molded reinforced plastic, wherein the molded reinforced plastic comprises a woven glass fiber cloth and a single epoxy resin, which is a bisphenol A epoxy resin.
Bibliography:Application Number: US201817261894