Passive devices over polycrystalline semiconductor fins

Structures including a passive device and methods of forming such structures. Multiple fins are positioned on a substrate, and an interconnect structure is positioned over the substrate. The fins contain a polycrystalline semiconductor material, and the interconnect structure includes a passive devi...

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Main Authors Lin, Teng-Yin, Lee, Tung-Hsing, Gu, Man, Zheng, Wang, Wang, Haiting
Format Patent
LanguageEnglish
Published 21.10.2021
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Abstract Structures including a passive device and methods of forming such structures. Multiple fins are positioned on a substrate, and an interconnect structure is positioned over the substrate. The fins contain a polycrystalline semiconductor material, and the interconnect structure includes a passive device that is positioned over the fins. The passive device may be, for example, an inductor or a transmission line.
AbstractList Structures including a passive device and methods of forming such structures. Multiple fins are positioned on a substrate, and an interconnect structure is positioned over the substrate. The fins contain a polycrystalline semiconductor material, and the interconnect structure includes a passive device that is positioned over the fins. The passive device may be, for example, an inductor or a transmission line.
Author Wang, Haiting
Lin, Teng-Yin
Gu, Man
Zheng, Wang
Lee, Tung-Hsing
Author_xml – fullname: Lin, Teng-Yin
– fullname: Lee, Tung-Hsing
– fullname: Gu, Man
– fullname: Zheng, Wang
– fullname: Wang, Haiting
BookMark eNrjYmDJy89L5WQwD0gsLs4sS1VISS3LTE4tVsgvSy1SKMjPqUwuqiwuSczJycxLVShOzc1Mzs9LKU0uyS9SSMvMK-ZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRobGRuYW5kaOhsbEqQIAAM0xiw
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US2021327872A1
GroupedDBID EVB
ID FETCH-epo_espacenet_US2021327872A13
IEDL.DBID EVB
IngestDate Fri Aug 30 05:45:54 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US2021327872A13
Notes Application Number: US202016853137
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211021&DB=EPODOC&CC=US&NR=2021327872A1
ParticipantIDs epo_espacenet_US2021327872A1
PublicationCentury 2000
PublicationDate 20211021
PublicationDateYYYYMMDD 2021-10-21
PublicationDate_xml – month: 10
  year: 2021
  text: 20211021
  day: 21
PublicationDecade 2020
PublicationYear 2021
RelatedCompanies GLOBALFOUNDRIES U.S. Inc
RelatedCompanies_xml – name: GLOBALFOUNDRIES U.S. Inc
Score 3.367001
Snippet Structures including a passive device and methods of forming such structures. Multiple fins are positioned on a substrate, and an interconnect structure is...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
SEMICONDUCTOR DEVICES
WAVEGUIDES
Title Passive devices over polycrystalline semiconductor fins
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211021&DB=EPODOC&locale=&CC=US&NR=2021327872A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5KFfWmVfFRJaDkFjSbTZMegtg8KELbYBvpraTJBgolKUlE-u-dWVLtqbd9wDC77Lx2Z74FeCavgvU50xJuWBrn4lWL0VJozMxEksYpz3pUjTwa94YR_5ib8xasd7UwEif0R4IjokQlKO-11Neb_0ssT-ZWVi_LFQ4Vb8HM8dQmOqZohumqN3D8cOJNXNV1nWiqjj_lnMHwdLJ3jJWOyJEmpH3_a0B1KZt9oxKcw3GI9PL6Aloi78Cpu_t7rQMno-bJG5uN9FWXYIXo6aJ2UlIh5Vuh9EtlU6y3SblFL4_gtYVSUbp7kROOa1Eq2SqvruAp8GfuUEMOFn8LXkTTfXaNa2jnRS5uQIktXReGHet9O-WMWTF9GUalrLFpZ0mW3kL3EKW7w9P3cEZd0sxM70K7Lr_FA5rcevkod-oXjWiE4A
link.rule.ids 230,309,786,891,25594,76903
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1bS8MwFD6MKc43nYqXqQWlb0WbZmv3UMS1G1V3Ka6VvZWuTWEw2tJWZP_ek9DpnvYWcuCQhJzLl5wLwCP3KkifEiWimq5Qyp6VEC2FQroJi-IwpkmPZyNPpj3Hp--L7qIB620ujKgT-iOKI6JERSjvldDX-f8jli1iK8un5QqnspeRZ9pyjY45miGqbA_MoTuzZ5ZsWaY_l6efgqYRvJ3kFbHSgY6gUIClrwHPS8l3jcroBA5d5JdWp9BgaRta1rb3WhuOJvWXNw5r6SvPQHfR00XtJMVMyLfEwy-lPFtvomKDXh4vr82kkoe7Zymv45oVUrJKy3N4GA09y1FwBcHfhgN_vrtc7QKaaZayS5BCXVWZZoRq34gpIXrIW4bxVNawayRREl9BZx-n6_3ke2g53mQcjN-mHzdwzElcSxO1A82q-Ga3aH6r5Z04tV_pcofK
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Passive+devices+over+polycrystalline+semiconductor+fins&rft.inventor=Lin%2C+Teng-Yin&rft.inventor=Lee%2C+Tung-Hsing&rft.inventor=Gu%2C+Man&rft.inventor=Zheng%2C+Wang&rft.inventor=Wang%2C+Haiting&rft.date=2021-10-21&rft.externalDBID=A1&rft.externalDocID=US2021327872A1