Passive devices over polycrystalline semiconductor fins
Structures including a passive device and methods of forming such structures. Multiple fins are positioned on a substrate, and an interconnect structure is positioned over the substrate. The fins contain a polycrystalline semiconductor material, and the interconnect structure includes a passive devi...
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Format | Patent |
Language | English |
Published |
21.10.2021
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Subjects | |
Online Access | Get full text |
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Abstract | Structures including a passive device and methods of forming such structures. Multiple fins are positioned on a substrate, and an interconnect structure is positioned over the substrate. The fins contain a polycrystalline semiconductor material, and the interconnect structure includes a passive device that is positioned over the fins. The passive device may be, for example, an inductor or a transmission line. |
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AbstractList | Structures including a passive device and methods of forming such structures. Multiple fins are positioned on a substrate, and an interconnect structure is positioned over the substrate. The fins contain a polycrystalline semiconductor material, and the interconnect structure includes a passive device that is positioned over the fins. The passive device may be, for example, an inductor or a transmission line. |
Author | Wang, Haiting Lin, Teng-Yin Gu, Man Zheng, Wang Lee, Tung-Hsing |
Author_xml | – fullname: Lin, Teng-Yin – fullname: Lee, Tung-Hsing – fullname: Gu, Man – fullname: Zheng, Wang – fullname: Wang, Haiting |
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Notes | Application Number: US202016853137 |
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Snippet | Structures including a passive device and methods of forming such structures. Multiple fins are positioned on a substrate, and an interconnect structure is... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE SEMICONDUCTOR DEVICES WAVEGUIDES |
Title | Passive devices over polycrystalline semiconductor fins |
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