ELECTRONIC PAPER PACKAGE STRUCTURE

An electronic paper package structure, including a substrate, an electronic ink layer, a cover plate, a water vapor barrier film and an adhesive layer, is provided. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer. The water vapor barrier film co...

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Bibliographic Details
Main Authors SHEN, Huang-Kai, TU, Ko-Fan, HUANG, Jen-Shiun
Format Patent
LanguageEnglish
Published 21.10.2021
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Summary:An electronic paper package structure, including a substrate, an electronic ink layer, a cover plate, a water vapor barrier film and an adhesive layer, is provided. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer. The water vapor barrier film covers the substrate and the electronic ink layer. The adhesive layer is directly bonded between the cover plate and the water vapor barrier film to seal the substrate and the electronic ink layer. The adhesive layer is not bonded between the cover plate and the electronic ink layer.
Bibliography:Application Number: US202117196061