ELECTRONIC PAPER PACKAGE STRUCTURE
An electronic paper package structure, including a substrate, an electronic ink layer, a cover plate, a water vapor barrier film and an adhesive layer, is provided. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer. The water vapor barrier film co...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
21.10.2021
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | An electronic paper package structure, including a substrate, an electronic ink layer, a cover plate, a water vapor barrier film and an adhesive layer, is provided. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer. The water vapor barrier film covers the substrate and the electronic ink layer. The adhesive layer is directly bonded between the cover plate and the water vapor barrier film to seal the substrate and the electronic ink layer. The adhesive layer is not bonded between the cover plate and the electronic ink layer. |
---|---|
Bibliography: | Application Number: US202117196061 |