SYSTEMS AND METHODS FOR SUBSTRATE SUPPORT TEMPERATURE CONTROL

Exemplary methods of semiconductor processing may include coupling a fluid conduit within a substrate support in a semiconductor processing chamber to a system foreline. The coupling may vacuum chuck a substrate with the substrate support. The methods may include flowing a gas into the fluid conduit...

Full description

Saved in:
Bibliographic Details
Main Authors Ramamurthi, Badri N, Baryshnikov, Anton V, Huang, Zubin, Radhakrishnan, Satish, Brillhart, Paul L, Shankaramurthy, Venkatanarayana, Janakiraman, Karthik, Kedlaya, Diwakar, Cheng, Rui
Format Patent
LanguageEnglish
Published 14.10.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Exemplary methods of semiconductor processing may include coupling a fluid conduit within a substrate support in a semiconductor processing chamber to a system foreline. The coupling may vacuum chuck a substrate with the substrate support. The methods may include flowing a gas into the fluid conduit. The methods may include maintaining a pressure between the substrate and the substrate support at a pressure higher than the pressure at the system foreline.
Bibliography:Application Number: US202016844764