SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

A semiconductor package includes a carrier having a recess, a semiconductor die arranged on the carrier such that a first side of the semiconductor die faces the carrier, and a contact clip arranged over a second side of the semiconductor die, opposite the first side. The contact clip includes a low...

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Main Authors Lee, Chee Hong, Arokiasamy, Xavier, Chong, Chee Chiew, Chiang, Chau Fatt, Chellamuthu, Naveendran, Muhammad, Muhammat Sanusi, Goa, Joo Ming, Tay, Wee Boon, Tan, Chee Voon
Format Patent
LanguageEnglish
Published 07.10.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package includes a carrier having a recess, a semiconductor die arranged on the carrier such that a first side of the semiconductor die faces the carrier, and a contact clip arranged over a second side of the semiconductor die, opposite the first side. The contact clip includes a lowered part. The lowered part is arranged in the recess.
Bibliography:Application Number: US202117210693