CONTACT BETWEEN INTERCONNECT AND ELECTRODE

Improved contact between interconnect and oxygen electrode material is achieved through a contact point between an electrode or a contact layer and a coated ferritic stainless steel interconnect, where the coating on the metallic interconnect comprises Cu.

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Bibliographic Details
Main Authors Küngas, Rainer, Rass-Hansen, Jeppe, Blennow, Bengt Peter Gustav, Holt Nørby, Tobias, Heiredal-Clausen, Thomas
Format Patent
LanguageEnglish
Published 30.09.2021
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Summary:Improved contact between interconnect and oxygen electrode material is achieved through a contact point between an electrode or a contact layer and a coated ferritic stainless steel interconnect, where the coating on the metallic interconnect comprises Cu.
Bibliography:Application Number: US202117338925