CONTACT BETWEEN INTERCONNECT AND ELECTRODE
Improved contact between interconnect and oxygen electrode material is achieved through a contact point between an electrode or a contact layer and a coated ferritic stainless steel interconnect, where the coating on the metallic interconnect comprises Cu.
Saved in:
Main Authors | , , , , |
---|---|
Format | Patent |
Language | English |
Published |
30.09.2021
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | Improved contact between interconnect and oxygen electrode material is achieved through a contact point between an electrode or a contact layer and a coated ferritic stainless steel interconnect, where the coating on the metallic interconnect comprises Cu. |
---|---|
Bibliography: | Application Number: US202117338925 |