SEMICONDUCTOR CLEANING EQUIPMENT AND METHOD FOR CLEANING THROUGH VIAS USING THE SAME

A method for cleaning a through via including the following steps is provided: heating a cleaning fluid to a predetermined temperature; mixing the cleaning liquid with an inert gas and entering into a cleaning cavity; atomizing the cleaning liquid in an atomizer to spray on a wafer surface and to we...

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Bibliographic Details
Main Authors YAO, Daping, CAO, Liqiang
Format Patent
LanguageEnglish
Published 23.09.2021
Subjects
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
ATOMISING APPARATUS
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
NOZZLES
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
SPRAYING APPARATUS
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
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Summary:A method for cleaning a through via including the following steps is provided: heating a cleaning fluid to a predetermined temperature; mixing the cleaning liquid with an inert gas and entering into a cleaning cavity; atomizing the cleaning liquid in an atomizer to spray on a wafer surface and to wet an inner wall and a bottom of the through via; and closing a cleaning liquid valve.
Bibliography:Application Number: US201817258449