Low Density Epoxy Syntactic Structural Adhesive for Automotive Applications

The present disclosure provides a syntactic structural adhesive comprising an epoxy resin, a low density particulate filler and a hardener that, upon curing, exhibits at least the following well-balanced properties: (i) a density less than 1 g/cm3; (ii) a compression modulus greater than 500 MPa; an...

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Bibliographic Details
Main Authors Xie, Rui, Trevino, III, Jose, Kuang, Wenfeng
Format Patent
LanguageEnglish
Published 23.09.2021
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:The present disclosure provides a syntactic structural adhesive comprising an epoxy resin, a low density particulate filler and a hardener that, upon curing, exhibits at least the following well-balanced properties: (i) a density less than 1 g/cm3; (ii) a compression modulus greater than 500 MPa; and (iii) a lap shear strength greater than 750 psi. The syntactic structural adhesive may be used in a variety of applications, such as in automotive applications for bonding and/or sealing metal, plastic and composite parts.
Bibliography:Application Number: US201916968915