METHOD AND SYSTEM FOR ESTABLISHING METAL INTERCONNECTION LAYER CAPACITANCE PREDICTION MODEL

• Main Authors: LU, Yang, JIANG, SHENGFENG
• Format: Patent
• Language: English
• Published: 09.09.2021
• Subjects: CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; PHYSICS

A method and a system for establishing a metal interconnection layer capacitance prediction model are disclosed. The method for establishing the metal interconnection layer capacitance prediction model includes: extracting capacitance data of metal interconnect layer capacitors of different sizes by using a post simulation tool and establishing a relationship formula between capacitance value and size of the metal interconnect layer capacitors; separately extracting relationship data between voltage and capacitance value of the metal interconnect layer capacitors and between temperature and capacitance value of the metal interconnect layer capacitors by using a process device simulation tool, and add the relationship data to the relationship formula; and establishing a simulation model in accordance with the relationship formula of capacitance value, size, voltage and temperature. The method has improved modeling speed and reduced circuit design cycle. The model thereof can be applied to the analysis of the small size capacitors with reliability.