RESINS FOR USE AS TIE LAYERS IN MULTILAYER FILMS AND MULTILAYER FILMS COMPRISING THE SAME

The present disclosure provides resins that can be used as a tie layer in a multilayer structure and to multilayer structures comprising one or more tie layers formed from such resins. In one aspect, a resin for use as a tie layer in a multilayer structure comprises a first composition, wherein the...

Full description

Saved in:
Bibliographic Details
Main Authors Zheng, Yong, Guerra, Suzanne M, Hansen, Sydney E, Walther, Brian W
Format Patent
LanguageEnglish
Published 09.09.2021
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:The present disclosure provides resins that can be used as a tie layer in a multilayer structure and to multilayer structures comprising one or more tie layers formed from such resins. In one aspect, a resin for use as a tie layer in a multilayer structure comprises a first composition, wherein the first composition comprises at least one ethylene-based polymer and wherein the first composition comprises a MWCDI value greater than 0.9, and a melt index ratio (I10/I2) that meets the following equation: I10/I2 ? 7.0−1.2×log (I2), wherein the first composition comprises 1 to 99 weight percent of the resin; and a maleic anhydride grafted polyethylene comprising a maleic anhydride grafted high density polyethylene, a maleic anhydride grafted linear low density polyethylene, a maleic anhydride grafted polyethylene elastomer, or a combination thereof, wherein the maleic anhydride grafted polyethylene comprises 1 to 99 weight percent of the resin.
Bibliography:Application Number: US201716332436