THREE-DIMENSIONAL FERROELECTRIC MEMORY
A memory device has ferroelectric memory cells arranged into a three-dimensional (3D) structure. Each ferroelectric memory cell has a ferroelectric layer adapted to provide non-volatile storage of data. In some cases, each ferroelectric memory cell is arranged as a ferroelectric field effect transis...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
02.09.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A memory device has ferroelectric memory cells arranged into a three-dimensional (3D) structure. Each ferroelectric memory cell has a ferroelectric layer adapted to provide non-volatile storage of data. In some cases, each ferroelectric memory cell is arranged as a ferroelectric field effect transistor (FeFET) comprising a source region, a drain region, and a control gate region, the control gate region comprising the ferroelectric layer. In other cases, each ferroelectric memory cell is arranged as a ferroelectric tunnel junction (FTJ) comprising opposing conductive electrode layers between which the ferroelectric layer and a tunnel junction layer are contactingly disposed. The ferroelectric layer may be formed of HfO2, ZrO2, Hf1-xZxO2, etc. The tunnel barrier layer may be formed of Al2O3, MgO, SrTiO3, etc. The memory can be used as a substitute for DRAM, a main memory in a data storage device, a data cache, etc. |
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Bibliography: | Application Number: US202017084940 |