A METHOD FOR INCREASING ADHESION STRENGTH BETWEEN A SURFACE OF COPPER OR COPPER ALLOY AND AN ORGANIC LAYER
The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps:(i) providing a non-conductive substrate comprising on at least one side said surface, said surface having a tota...
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Main Authors | , , , , , , , , , |
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Format | Patent |
Language | English |
Published |
12.08.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps:(i) providing a non-conductive substrate comprising on at least one side said surface, said surface having a total surface area of copper or copper alloy,(ii) contacting said substrate comprising said surface with an acidic aqueous non-etching protector solution comprising(ii-a) one or more than one amino azole,(ii-b) one or more than one organic acid and/or salts thereof,(ii-c) one or more than one peroxide in a total amount of 0.4 wt-% or less, based on the total weight of the protector solution, and(ii-d) inorganic acids in a total amount of 0 to 0.01 wt-%, based on the total weight of the protector solution,wherein during step (ii) the total surface area of said surface is not increased upon contacting with the protector solution. |
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Bibliography: | Application Number: US201917052545 |