Systems And Methods To Increase Sensor Robustness

An apparatus is described. The apparatus including a substrate; one or more sensors and one or more electrical circuits formed on the substrate, the one or more electrical circuits electrically coupled with at least one of the one or more sensors; and a metal layer formed over the sensors, wherein t...

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Bibliographic Details
Main Authors Olsen, Clark T, Davis, Michael W, Riemer, Douglas P, Lang, Matthew S
Format Patent
LanguageEnglish
Published 12.08.2021
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Summary:An apparatus is described. The apparatus including a substrate; one or more sensors and one or more electrical circuits formed on the substrate, the one or more electrical circuits electrically coupled with at least one of the one or more sensors; and a metal layer formed over the sensors, wherein the metal layer is positioned over the one or more sensors to provide a barrier.
Bibliography:Application Number: US202017030108