TOOL ARCHITECTURE FOR WAFER GEOMETRY MEASUREMENT IN SEMICONDUCTOR INDUSTRY
A semiconductor equipment architecture WGT for wafer shape and flatness measurement is disclosed. The semiconductor equipment architecture WGT includes a reflective air-bearing chuck and a hybrid wafer thickness gauge. Also disclosed are the corresponding methods of measuring wafer shape and flatnes...
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Main Author | |
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Format | Patent |
Language | English |
Published |
12.08.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor equipment architecture WGT for wafer shape and flatness measurement is disclosed. The semiconductor equipment architecture WGT includes a reflective air-bearing chuck and a hybrid wafer thickness gauge. Also disclosed are the corresponding methods of measuring wafer shape and flatness using the architecture, the air-bearing chuck and the hybrid wafer thickness gauge. |
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Bibliography: | Application Number: US202017272115 |