Electrical Interconnect Structure with Radial Spokes for Improved Solder Void Control

• Main Authors: Gan, Tek Keong, Keh, Ser Yee, Stadler, Michael, Lem, Tien Heng, Calo, Paul Armand Asentista, Lim, Fong, Tay, Mei Qi
• Format: Patent
• Language: English
• Published: 29.07.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An electrical interconnect structure includes a bond pad having a substantially planar bonding surface, and a solder enhancing structure that is disposed on the bonding surface and includes a plurality of raised spokes that are each elevated from the bonding surface. Each of the raised spokes has a...