Electrical Interconnect Structure with Radial Spokes for Improved Solder Void Control

An electrical interconnect structure includes a bond pad having a substantially planar bonding surface, and a solder enhancing structure that is disposed on the bonding surface and includes a plurality of raised spokes that are each elevated from the bonding surface. Each of the raised spokes has a...

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Bibliographic Details
Main Authors Gan, Tek Keong, Keh, Ser Yee, Stadler, Michael, Lem, Tien Heng, Calo, Paul Armand Asentista, Lim, Fong, Tay, Mei Qi
Format Patent
LanguageEnglish
Published 29.07.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electrical interconnect structure includes a bond pad having a substantially planar bonding surface, and a solder enhancing structure that is disposed on the bonding surface and includes a plurality of raised spokes that are each elevated from the bonding surface. Each of the raised spokes has a lower wettability relative to a liquefied solder material than the bonding surface. Each of the raised spokes extend radially outward from a center of the solder enhancing structure.
Bibliography:Application Number: US202016774800