DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING

A method includes applying a sintering precursor material layer to each of a first surface and a second surface of a ceramic tile, and assembling a precursor assembly of a direct bonded copper (DBC) substrate by coupling a first leadframe on the sinter precursor material layer on the first surface o...

Full description

Saved in:
Bibliographic Details
Main Authors KRISHNAN, Shutesh, CARNEY, Francis J, TOLENTINO, Erik Nino Mercado
Format Patent
LanguageEnglish
Published 22.07.2021
Subjects
BASIC ELECTRIC ELEMENTS
CASTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
PERFORMING OPERATIONS
POWDER METALLURGY
SEMICONDUCTOR DEVICES
TRANSPORTING
WORKING METALLIC POWDER
Online AccessGet full text

Cover

More Information
Summary:A method includes applying a sintering precursor material layer to each of a first surface and a second surface of a ceramic tile, and assembling a precursor assembly of a direct bonded copper (DBC) substrate by coupling a first leadframe on the sinter precursor material layer on the first surface of the ceramic tile and a second leadframe on the second surface of the sinter precursor material layer on a second surface of the ceramic tile such that the ceramic tile is disposed between the first leadframe and the second leadframe. The method further includes sinter bonding the first leadframe and the second leadframe to the ceramic tile to form a sinter bonded DBC substrate.
Bibliography:Application Number: US202016744378