MICROSTRUCTURED RELEASE LINERS FOR SELECTIVE TRANSFER OF INK TO FILM

Modified adhesive layers are prepared by contacting an adhesive layer to a modified microstructured release liner. The modified release liner has a release layer surface with a set of microstructured depressions and a discontinuous pattern of ink material located on the surface of the release layer....

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Bibliographic Details
Main Authors Behling, Ross E, Chen-Ho, Kui, Smith, Matthew R. D, Stay, Matthew S, Kurian, Anish, Yeshe, Patrick J
Format Patent
LanguageEnglish
Published 22.07.2021
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Summary:Modified adhesive layers are prepared by contacting an adhesive layer to a modified microstructured release liner. The modified release liner has a release layer surface with a set of microstructured depressions and a discontinuous pattern of ink material located on the surface of the release layer. A portion of the discontinuous pattern of ink material overlaps with and is located within some of the depressions. The ink material comprises a non-adhesive but adhesively transferrable material, or an adhesive material. Upon removal of the adhesive from the release liner, the ink material transfers to the adhesive surface.
Bibliography:Application Number: US201915734349