MULTI-LAYERED, SHIELDED AND GROUNDED CABLES AND RELATED METHODS
Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.
Saved in:
Main Authors | , , , , , , , , |
---|---|
Format | Patent |
Language | English |
Published |
15.07.2021
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path. |
---|---|
AbstractList | Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path. |
Author | WEHRLI, Andrew J SULLIVAN, Jared D JONES, Eran J SCHULZ, Darian ISAAC, Ayman GADER, David MCGEE, Michael Ward, Todd D BARDELLA, Gianni R |
Author_xml | – fullname: MCGEE, Michael – fullname: SULLIVAN, Jared D – fullname: BARDELLA, Gianni R – fullname: ISAAC, Ayman – fullname: GADER, David – fullname: SCHULZ, Darian – fullname: JONES, Eran J – fullname: WEHRLI, Andrew J – fullname: Ward, Todd D |
BookMark | eNrjYmDJy89L5WSw9w31CfHU9XGMdA1yddFRCPbwdPVxcXVRcPRzUXAP8g_1A3GcHZ18XIPBYkGuPo4hQCFf1xAPf5dgHgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oSHxpsZGBkaGRobmpi6GhoTJwqAA7bLJM |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
ExternalDocumentID | US2021217541A1 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US2021217541A13 |
IEDL.DBID | EVB |
IngestDate | Fri Oct 18 06:02:17 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US2021217541A13 |
Notes | Application Number: US202117148603 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210715&DB=EPODOC&CC=US&NR=2021217541A1 |
ParticipantIDs | epo_espacenet_US2021217541A1 |
PublicationCentury | 2000 |
PublicationDate | 20210715 |
PublicationDateYYYYMMDD | 2021-07-15 |
PublicationDate_xml | – month: 07 year: 2021 text: 20210715 day: 15 |
PublicationDecade | 2020 |
PublicationYear | 2021 |
RelatedCompanies | Molex, LLC |
RelatedCompanies_xml | – name: Molex, LLC |
Score | 3.3378305 |
Snippet | Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS CURRENT COLLECTORS ELECTRICITY INSULATORS LINE CONNECTORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES |
Title | MULTI-LAYERED, SHIELDED AND GROUNDED CABLES AND RELATED METHODS |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210715&DB=EPODOC&locale=&CC=US&NR=2021217541A1 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFPVNp-LHlILSJ4vt2tj2YYyuSemk68baynwabZaCIN1wFf99k9DpnvaW3MGRBO4r-d0F4NFkRokc19GsvMg1CxlUc53S1oqlzhxKS6bnEiAbv4SZ9TpH8xZ8bmthZJ_QH9kckWsU5fpeS3u9_r_EwhJbuXkuPjhpNQjSPlab7JjnL7aBVDzsk-kET3zV9_tZosYzyePRN7IMj-dKBzyQtgUAjLwNRV3KetepBKdwOOXyqvoMWqzqwLG__XutA0fj5smbDxvt25zDYJxF6UiLvHcyI_hJScIRiTDBihdjReDnYzHxvWFEEkkT_2Fwy6SMSRpOcHIBDwFJ_VDjK1n8bXyRJbvLNi-hXa0qdgWK6ziFqReoLG1quTrLGVr2lj03NyjjPpdeQ3efpJv97Fs4EVNxg2mgLrTrr292x11vXdzLE_sF5T2Bdw |
link.rule.ids | 230,309,783,888,25578,76884 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR1NS8Mw9DGmOG86FT-mFpSeLLZb49LDGF2T0WnbjbWVeRptloIg3XAV_75J2NTTbkkePF4C7zPvA-C-w60CYQcbdpZnho0sZji46Br5wuSYsYKbmUqQjZ781H6eoVkNPra1MKpP6Ldqjig4igl-r5S8Xv0FsYjKrVw_5u_iaNkfJj2ib7xj4b90LaSTQY9OxmTs6Z7XS2M9miqYsL6RbbnCV9oTRjaWnfbp60DWpaz-K5XhEexPBL6yOoYaL5vQ8Laz15pwEG6-vMVyw33rE-iHaZCMjMB9o1NKHrTYH9GAUKK5EdFk_nwkN547CGiszuQ8DCGZtJAm_pjEp3A3pInnG4KS-e_F52n8n-zOGdTLZcnPQXMwzjtmjoqiy2zH5BlHi_ai7WQW40Lnsgto7cJ0uRt8Cw0_CYN5MIperuBQgmQ000ItqFefX_xaqOEqv1Gv9wMfpIRn |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=MULTI-LAYERED%2C+SHIELDED+AND+GROUNDED+CABLES+AND+RELATED+METHODS&rft.inventor=MCGEE%2C+Michael&rft.inventor=SULLIVAN%2C+Jared+D&rft.inventor=BARDELLA%2C+Gianni+R&rft.inventor=ISAAC%2C+Ayman&rft.inventor=GADER%2C+David&rft.inventor=SCHULZ%2C+Darian&rft.inventor=JONES%2C+Eran+J&rft.inventor=WEHRLI%2C+Andrew+J&rft.inventor=Ward%2C+Todd+D&rft.date=2021-07-15&rft.externalDBID=A1&rft.externalDocID=US2021217541A1 |