MULTI-LAYERED, SHIELDED AND GROUNDED CABLES AND RELATED METHODS

Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.

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Bibliographic Details
Main Authors MCGEE, Michael, SULLIVAN, Jared D, BARDELLA, Gianni R, ISAAC, Ayman, GADER, David, SCHULZ, Darian, JONES, Eran J, WEHRLI, Andrew J, Ward, Todd D
Format Patent
LanguageEnglish
Published 15.07.2021
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Summary:Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.
Bibliography:Application Number: US202117148603