SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

A method of manufacturing a semiconductor device includes providing a carrier, disposing a first pad on the carrier, forming a post on the first pad, and disposing a joint adjacent to the post and the first pad to form a first entire contact interface between the first pad and the joint and a second...

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Main Authors MIAO, CHIAUN, LU, CHUN-LIN, LIANG, SHIH-WEI, WANG, YEN-PING, TSAI, HAO-YI, YANG, CHING-FENG, WU, KAIIANG, LIU, MING-KAI
Format Patent
LanguageEnglish
Published 08.07.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of manufacturing a semiconductor device includes providing a carrier, disposing a first pad on the carrier, forming a post on the first pad, and disposing a joint adjacent to the post and the first pad to form a first entire contact interface between the first pad and the joint and a second entire contact interface between the first pad and the post. The first entire contact interface and the second entire contact interface are flat surfaces.
Bibliography:Application Number: US202117209113