METHOD OF FORMING DISPLAY DEVICE WITH LIGHT-EMITTING DIODE

A method includes preparing a substrate with a first and a second conductive pad thereon; bonding a light-emitting diode to the first conductive pad; forming a photoresist layer on the substrate such that a difference between a thickness of a portion of the photoresist layer overlying the light-emit...

Full description

Saved in:
Bibliographic Details
Main Author CHEN, Li-Yi
Format Patent
LanguageEnglish
Published 24.06.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A method includes preparing a substrate with a first and a second conductive pad thereon; bonding a light-emitting diode to the first conductive pad; forming a photoresist layer on the substrate such that a difference between a thickness of a portion of the photoresist layer overlying the light-emitting diode and a thickness of another portion of the photoresist layer free from overlapping with the light-emitting diode and the second conductive pad is greater than a distance from an interface between the second type semiconductor layer and the active layer to a top surface of the substrate; respectively exposing a first and a second exposure region of the photoresist layer with a first and a second exposure dose; and developing the exposed photoresist layer till the top surface of the second type semiconductor layer and a top surface of the second conductive pad are exposed from the photoresist layer.
Bibliography:Application Number: US201916726273