SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

A semiconductor device including a semiconductor chip having a first surface and a second surface opposite to the first surface, a first heat dissipation member on the second surface of the semiconductor chip, the first heat dissipation member having a vertical thermal conductivity in a direction pe...

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Bibliographic Details
Main Authors LEE, Seonho, LEE, Jaekul, MYUNG, Junwoo, KIM, Jinsu, PARK, Yongjin
Format Patent
LanguageEnglish
Published 24.06.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device including a semiconductor chip having a first surface and a second surface opposite to the first surface, a first heat dissipation member on the second surface of the semiconductor chip, the first heat dissipation member having a vertical thermal conductivity in a direction perpendicular to the second surface, and a horizontal thermal conductivity in a direction parallel to the second surface, the first vertical thermal conductivity being smaller than the first horizontal thermal conductivity, and a second heat dissipation member comprising a vertical pattern penetrating the first heat dissipation member, the second heat dissipation member having a vertical thermal conductivity that is greater than the vertical thermal conductivity of the first heat dissipation member may be provided.
Bibliography:Application Number: US202017029334