PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL

• Main Authors: Sano, Kentaro, Kuroda, Taiki, Uchida, Hiroyuki, Kamae, Toshiya
• Format: Patent
• Language: English
• Published: 24.06.2021
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

Disclosed is a prepreg comprising an epoxy resin composition containing [A] an epoxy resin and [B] a curing agent, and a reinforcing fiber, wherein the epoxy resin composition satisfies:(a) [A1] an epoxy resin represented by the general formula (I) is contained as the epoxy resin [A], and [A1′] an epoxy resin satisfying: n≥2 among the component [A1];wherein, R1, R2 and R3 each independently represent a hydrogen atom or a methyl group, and n represents an integer of 1 or more; (b) the entire epoxy resin has an average epoxy equivalent of 165 to 265 g/eq; (c) a water absorption coefficient at 85° C. and 95% RH for 2 hours is 3.0% by mass or less based on 100% by mass of the epoxy resin composition; (d) [B1] an aromatic urea as [B] a curing agent; and (e) the content of [B2] dicyandiamide is 0.5 part by mass or less based on 100 parts by mass of the entire epoxy resin.