CLEANING COMPOSITION
A cleaning composition is disclosed. The cleaning composition includes a hydroxy acid, a hydrogen bond acceptor, and a surfactant. The hydroxy acid and hydrogen bond acceptor are present at a molar ratio of from about 5:1 to about 1.5:1.
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
10.06.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A cleaning composition is disclosed. The cleaning composition includes a hydroxy acid, a hydrogen bond acceptor, and a surfactant. The hydroxy acid and hydrogen bond acceptor are present at a molar ratio of from about 5:1 to about 1.5:1. |
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Bibliography: | Application Number: US202017111693 |