CLEANING COMPOSITION

A cleaning composition is disclosed. The cleaning composition includes a hydroxy acid, a hydrogen bond acceptor, and a surfactant. The hydroxy acid and hydrogen bond acceptor are present at a molar ratio of from about 5:1 to about 1.5:1.

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Bibliographic Details
Main Authors Barnabas, Freddy Arthur, Waning, Gregory Thomas, Bacca, Lori Ann
Format Patent
LanguageEnglish
Published 10.06.2021
Subjects
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Summary:A cleaning composition is disclosed. The cleaning composition includes a hydroxy acid, a hydrogen bond acceptor, and a surfactant. The hydroxy acid and hydrogen bond acceptor are present at a molar ratio of from about 5:1 to about 1.5:1.
Bibliography:Application Number: US202017111693