SEMICONDUCTOR DEVICE INCLUDING AN ELECTRICAL CONTACT WITH A METAL LAYER ARRANGED THEREON

A semiconductor device includes a semiconductor die, an electrical contact arranged on a surface of the semiconductor die, and a metal layer arranged on the electrical contact, wherein the metal layer includes a singulated part of at least one of a metal foil, a metal sheet, a metal leadframe, or a...

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Main Authors HELLMUND, Oliver, MURI, Ingo, EICHINGER, Barbara, MEYER, Thorsten
Format Patent
LanguageEnglish
Published 03.06.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract A semiconductor device includes a semiconductor die, an electrical contact arranged on a surface of the semiconductor die, and a metal layer arranged on the electrical contact, wherein the metal layer includes a singulated part of at least one of a metal foil, a metal sheet, a metal leadframe, or a metal plate. When viewed in a direction perpendicular to the surface of the semiconductor die, a footprint of the electrical contact and a footprint of the metal layer are substantially congruent.
AbstractList A semiconductor device includes a semiconductor die, an electrical contact arranged on a surface of the semiconductor die, and a metal layer arranged on the electrical contact, wherein the metal layer includes a singulated part of at least one of a metal foil, a metal sheet, a metal leadframe, or a metal plate. When viewed in a direction perpendicular to the surface of the semiconductor die, a footprint of the electrical contact and a footprint of the metal layer are substantially congruent.
Author MURI, Ingo
HELLMUND, Oliver
MEYER, Thorsten
EICHINGER, Barbara
Author_xml – fullname: HELLMUND, Oliver
– fullname: MURI, Ingo
– fullname: EICHINGER, Barbara
– fullname: MEYER, Thorsten
BookMark eNqNyrsKwkAQQNEttPD1DwPWQh4Q62F2TBY2G9jM-qhCkLWSJBD_H1P4AVYXLmerVsM4xI26t1wbapwOJI0HzVdDDMaRDdq4EtABWybxhtDCAgVJ4GakAoSaZZkWH-wBvUdXsgap2HPj9mr96t9zPPy6U8cLC1WnOI1dnKf-GYf46UKbJVmaFuckLzDN_1Nf5NIzrg
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US2021167036A1
GroupedDBID EVB
ID FETCH-epo_espacenet_US2021167036A13
IEDL.DBID EVB
IngestDate Fri Jul 19 12:55:16 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US2021167036A13
Notes Application Number: US202017101339
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210603&DB=EPODOC&CC=US&NR=2021167036A1
ParticipantIDs epo_espacenet_US2021167036A1
PublicationCentury 2000
PublicationDate 20210603
PublicationDateYYYYMMDD 2021-06-03
PublicationDate_xml – month: 06
  year: 2021
  text: 20210603
  day: 03
PublicationDecade 2020
PublicationYear 2021
RelatedCompanies Infineon Technologies AG
RelatedCompanies_xml – name: Infineon Technologies AG
Score 3.3426409
Snippet A semiconductor device includes a semiconductor die, an electrical contact arranged on a surface of the semiconductor die, and a metal layer arranged on the...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title SEMICONDUCTOR DEVICE INCLUDING AN ELECTRICAL CONTACT WITH A METAL LAYER ARRANGED THEREON
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210603&DB=EPODOC&locale=&CC=US&NR=2021167036A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8QNOqbosYPNE00e1tkrMzxQMzoCsOMjYwO8YlsYyQmZhCZ8d_32oDyxFu_cmkvud792uuvAI-tNiJjSnP92TQSnWZ5S7fnGMjNG1mWNxFAp4rEdRhYXkxfp61pBT63b2EUT-iPIkdEi8rQ3ku1X6_-D7FclVu5fko_sGn50hMdV9ugY8QvVsPU3G6Hj0I3ZBpjnXisBZHqMyzJNuUgVjqQgbRk2ueTrnyXstp1Kr1TOByhvKI8g0pe1OCYbf9eq8HRcHPljcWN9a3PYTqWSgsDN2YijIjLJwPGCcJyH6O6oE-cgHCfMyG_cfQJDhQOE-RtIDzikCEX2Og77zwiThQ5QZ-7RHg84mFwAQ89Lpin4xRnfxqZxePd9ZiXUC2WRX4FxLKNpIk2lZhGStsLaic0tRZGijguMe20fQ31fZJu9nffwomsqkwpsw7V8us7v0OfXKb3SpW_DF-Gzw
link.rule.ids 230,309,786,891,25594,76906
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3fT8IwEL4QNOKbosYfqE00e1tkbAx4IGZ0haFbR0aH-ES2MRITM4jM-O97a0B54q25a5r2kuvd1_a-Ajw2O4iMDSNVW7oWqUaSNtX2HBO5eT1J0gYC6FiSuHrcdELjZdqcluBzWwsjeUJ_JDkielSC_p7L_Xr1f4hly7eV66f4A0XL577o2soGHSN-Meu6Yve6bOTbPlUo7YZjhQdSp5kF25SFWOmgVfDzFsnTpFfUpax2g0r_BA5HOF6Wn0IpzapQodu_16pw5G2uvLG58b71GUzHhdF8bodU-AGx2WRIGUFY7mJWxwfE4oS5jIriG0eXYEdhUUHehsIhFvGYQKFrvbOAWEFg8QGziXBYwHx-Dg99Jqij4hRnfxaZhePd9egXUM6WWXoJxGxrUQN9KtK12OgsjHZkxOZCixHHRXo77lxBbd9I1_vV91BxhOfO3CF_vYHjQiVfTek1KOdf3-ktxuc8vpNm_QWDe4m8
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=SEMICONDUCTOR+DEVICE+INCLUDING+AN+ELECTRICAL+CONTACT+WITH+A+METAL+LAYER+ARRANGED+THEREON&rft.inventor=HELLMUND%2C+Oliver&rft.inventor=MURI%2C+Ingo&rft.inventor=EICHINGER%2C+Barbara&rft.inventor=MEYER%2C+Thorsten&rft.date=2021-06-03&rft.externalDBID=A1&rft.externalDocID=US2021167036A1